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891
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Advanced Materials for Thermal Management of Electronic Packaging
Thermally Conductive Polymer Matrix Composites
other
Author(s):
Xingcun Colin Tong
Publication date
(Online):
November 29 2010
Publisher:
Springer New York
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International Polymer Processing
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Effective Thermal Conductivity of Composites with Interfacial Thermal Barrier Resistance
D.P.H. Hasselman
,
L. Johnson
(1987)
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Thermal Interface Materials: Historical Perspective, Status, and Future Directions
R. Prasher
(2006)
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Estimation on thermal conductivities of filled polymers
Y. Agari
,
T Uno
(1986)
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Author and book information
Book Chapter
Publication date (Print):
2011
Publication date (Online):
November 29 2010
Pages
: 201-232
DOI:
10.1007/978-1-4419-7759-5_5
SO-VID:
8c2694e5-0192-4b86-a0bf-fbf35c7ab58d
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Book chapters
pp. 1
Thermal Management Fundamentals and Design Guides in Electronic Packaging
pp. 59
Characterization Methodologies of Thermal Management Materials
pp. 131
Electronic Packaging Materials and Their Functions in Thermal Managements
pp. 169
Monolithic Carbonaceous Materials and Carbon Matrix Composites
pp. 201
Thermally Conductive Polymer Matrix Composites
pp. 233
High Thermal Conductivity Metal Matrix Composites
pp. 277
Thermally Conductive Ceramic Matrix Composites
pp. 305
Thermal Interface Materials in Electronic Packaging
pp. 373
Materials and Design for Advanced Heat Spreader and Air Cooling Heat Sinks
pp. 421
Liquid Cooling Devices and Their Materials Selection
pp. 477
Thermoelectric Cooling Through Thermoelectric Materials
pp. 527
Development and Application of Advanced Thermal Management Materials
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