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      Three-Dimensional Molded Interconnect Devices (3D-MID) : Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers

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      Carl Hanser Verlag GmbH & Co. KG

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          978-1-56990-551-7
          978-1-56990-552-4
          April 2014
          10.3139/9781569905524
          9429ce72-ba2f-4196-92fa-9156bff9ecb9
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