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      Transient Hygrothermal-Response of Power Modules in Inverters—The Basis for Mission Profiling Under Climate and Power Loading

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            Interfacial Delamination Mechanisms During Soldering Reflow With Moisture Preconditioning

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              Moisture Sensitivity of Plastic Packages of IC Devices

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                Author and article information

                Journal
                Title: IEEE Transactions on Power Electronics
                Abbreviated Title: IEEE Trans. Power Electron.
                Publisher: Institute of Electrical and Electronics Engineers (IEEE)
                ISSN (Print): 0885-8993
                ISSN (Electronic): 1941-0107
                Publication date Created: January 2016
                Publication date (Print): January 2016
                Volume: 31
                Issue: 1
                Pages: 613-620
                Article
                DOI: 10.1109/TPEL.2015.2408117
                SO-VID: 272b4dc0-6a49-4709-b993-a079b8a99ebf
                Copyright © © 2016
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